集成點(diǎn)負(fù)載功率模塊是設(shè)計(jì)成符合工業(yè)標(biāo)準(zhǔn)的，緊湊的，類似IC的模制封裝的模塊。它們具有高集成度，不需再額外配置外部組件就可以實(shí)現(xiàn)通常點(diǎn)負(fù)載功率模塊的所有功能。集成點(diǎn)負(fù)載功率模塊下面的銅箔焊盤，與內(nèi)部的功率熱組件連接非常緊 ，因此它具有非常優(yōu)秀的散熱表現(xiàn)。所有的集成點(diǎn)負(fù)載功率模塊都已實(shí)現(xiàn)全自動(dòng)化生產(chǎn)。
| Part Number | Vin Range (VDC) | Vout Nominal (VDC) | lout (A) | Power (W) | Eff (%) | Package | LxWxH (mm) |
|---|---|---|---|---|---|---|---|
| H60SB0A050NRDC | 9~60 | 0~60 | 50 | 3000 | 96 | 1/2 brick | 63.2x60.6x13 |
| T31SN12008 | 9~53 | 3.3~16.5 | 8 | 100 | 98 | 1/32 brick | 19.1x23.4x9.6 |
| T31SN24005 | 9~53 | 5~30 | 4.5 | 100 | 98 | 1/32 brick | 19.1x23.4x9.6 |
| E50SN12051 | 40~60 | 12 | 51 | 600 | 97.3 | 1/8 brick | 58.4x22.8x12.7 |
| V50SN12017 | 40~60 | 12 | 17 | 200 | 97 | 1/16 brick | 33x22.8x9.5 |
| Part Number | Vin Range (VDC) | Vout Nominal (VDC) | lout (A) | Power (W) | Eff (%) | Package | LxWxH (mm) |
|---|---|---|---|---|---|---|---|
| H60SB0A050NRDC | 9~60 | 0~60 | 50 | 3000 | 96 | 1/2 brick | 63.2x60.6x13 |
| T31SN12008 | 9~53 | 3.3~16.5 | 8 | 100 | 98 | 1/32 brick | 19.1x23.4x9.6 |
| T31SN24005 | 9~53 | 5~30 | 4.5 | 100 | 98 | 1/32 brick | 19.1x23.4x9.6 |
| E50SN12051 | 40~60 | 12 | 51 | 600 | 97.3 | 1/8 brick | 58.4x22.8x12.7 |
| V50SN12017 | 40~60 | 12 | 17 | 200 | 97 | 1/16 brick | 33x22.8x9.5 |
